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In this study, the ungated AlGaN/GaN devices with special mesa structures were designed. The hypothesis of effective width expansion was tested experimentally by using ungated samples with different sizes, and an empirical expression for calculating the conduction channel effective width was given according to the experimental results. Finally, split-gate AlGaN/GaN heterostructure field-effect transistors (HFETs) with different gate lengths were prepared, and the channel electron mobility of split-gate samples was calculated by using the empirical expression and polarization Coulomb field (PCF) scattering theoretical model. The results showed that, for split-gate AlGaN/GaN HFETs, with the increase in the gate length, the total amount of additional polarization charges underneath the gate increases, resulting in the enhancement of the PCF scattering intensity. [ABSTRACT FROM AUTHOR]

E-mode P-GaN/AlGaN/GaN heterostructure field-effect transistors (HFETs) of various sizes were fabricated, and their parasitic source resistance (RS) was measured. The measurement results showed that RS varied greatly with changing gate bias, and the degree of RS change also differed with the gate bias of different-sized device samples. Through theoretical analysis, it is found that polarization Coulomb field (PCF) scattering caused by the device process and gate bias can affect electron mobility ( μ GS ) in the gate-source region, which causes the variations in μ GS for different-sized devices and same-sized devices under different gate biases. When μ GS changes with the device size and gate bias, the RS will change accordingly. Our study is the first to discover the gate bias dependency of RS for E-mode P-GaN/AlGaN/GaN HFETs due to PCF scattering, which provides a new idea for further in-depth studies on the RS of E-mode P-GaN/AlGaN/GaN HFETs and device performance optimization. [ABSTRACT FROM AUTHOR]

AlGaN/GaN heterostructure field-effect transistors (HFETs) with three kinds of gate lengths were fabricated, and the theory of polarization Coulomb field (PCF) scattering with the electron systems in the AlGaN/GaN HFETs was studied. There are two methods of analysis and calculation of the PCF scattering in AlGaN/GaN HFETs: one is by considering the 2-dimensional electronic gas (2DEG) of the gate-source, gate-drain, and gate regions as three independent electron systems and the other is by considering the 2DEG of the drain–source channel as a unified electron system. The calculation and analysis of the additional polarization charges underneath the gate region for the prepared AlGaN/GaN HFETs indicate that the theory of PCF scattering in AlGaN/GaN HFETs with three independent electron systems is more accurate. [ABSTRACT FROM AUTHOR]

• Normally-off recessed gate AlGaN/GaN MIS-HEMTs with ALD-Al 2 O 3 gate dielectric stack was fabricated. • The effect mechanism of PCF scattering on electrical properties of normally-off recessed gate AlGaN/GaN MIS-HEMTs was studied and clarified. • For the region underneath the gate, the increase in V GS resulted in an increase in Δ ρ G and n 2 D E G , moreover, the effect of n 2 D E G for PCF scattering is more significant than Δ ρ G. • For the gate-source region and gate-drain region, the parasitic resistance changes with V GS owing to the effect of PCF scattering, moreover, the effect of PCF scattering on the R S _ C H is stronger than R D _ C H . • This study perfects the carrier transport model of normally-off recessed gate AlGaN/GaN MIS-HEMTs and provides a new theoretical foundation for the device of this type to improving the electron mobility and reducing parasitic resistance. In this study, normally-off recessed gate AlGaN/GaN MIS-HEMT with ALD-Al 2 O 3 gate dielectric stack was fabricated. The influence of polarization Coulomb field (PCF) scattering on electrical properties of normally-off recessed gate AlGaN/GaN MIS-HEMTs with ALD-Al 2 O 3 gate dielectric stack was studied. Based on the measured I-V data, the electrical parameters such as additional polarization charge (Δ ρ G), electron mobility (μ), gate-source (G-S) parasitic resistance (R S) and gate-drain (G-D) parasitic resistance (R D) were obtained by iterative calculation method. Through systematic analyzed of these results, it was found that the positive G-S voltage (V GS) induces tensile strain in the ultra-thin AlGaN barrier layer, which was AlGaN remaining after etching and existsed between the gate dielectric and the GaN channel, resulting in positive Δ ρ G under the gate. With the increase of V GS , the inverse piezoelectric effect in the ultra-thin AlGaN layer increases and the amount of Δ ρ G increases. At the same time, the positive V GS induces two-dimensional electron gas (2DEG) underneath the gate, which is also positively correlated with the V GS. Compared with Δ ρ G , the 2DEG density (n 2 D E G ) has a greater effect on the PCF scattering strength. We also found that the influence of PCF scattering on R S and R D is different, which is related to the difference between G-S distance and G-D distance. This study provides a new theoretical basis for normally-off recessed gate AlGaN/GaN MIS-HEMTs to improving μ and reducing parasitic resistance. [ABSTRACT FROM AUTHOR]

An InAlN/GaN MIS-HEMT with ZrO 2 gate dielectric layer and a Schottky-gate InAlN/GaN HEMT were fabricated. Subsequently, the influence of ZrO 2 gate dielectric layer on polarization Coulomb field (PCF) scattering in InAlN/GaN MIS-HEMT was studied. Compared with InAlN/GaN HEMT, the ZrO 2 gate dielectric layer in InAlN/GaN MIS-HEMT results in fewer additional polarization charge and higher two-dimensional electron gas density at the same gate-source voltage (V GS) conditions. Also, we established that both of these factors weaken PCF scattering intensity. However, the InAlN/GaN MIS-HEMT has a larger gate swing. Therefore, there is a smaller V GS was applied during regular operation of device. When the V GS is small, PCF scattering is the strongest scattering and play non-negligible impact in the size of total electron mobility. This study provides a new theoretical foundation for further enhancing the performance of InAlN/GaN MIS-HEMTs. • The influence of the ZrO 2 gate dielectric layer on PCF scattering in InAlN/GaN MIS-HEMTs was determined. • The ZrO 2 layer leads to fewer Δ ρ G and higher n 2 D E G at the same gate bias conditions, both of these factors weaken PCF scattering intensity. • When the gate bias is small, PCF scattering plays a dominant role in the magnitude of the total electron mobility. • The results of this study have providing a new theoretical basis for further enhancing performance of InAlN/GaN MIS-HEMTs. [ABSTRACT FROM AUTHOR]

• The mechanism of enhanced for PCF scattering in AlN/GaN HFETs has been clarified. • A large number of additional polarization charges (Δ ρ G) are generated under the gate. • Δ ρ G will become saturated with the decrease in gate bias. • The decreases of 2DEG density will enhance the PCF scattering intensity. AlN/GaN heterostructure field-effect transistors (HFETs) was fabricated. Based on the polarization Coulomb field (PCF) scattering theory model, the additional polarization charges and mobility are obtained by iterative calculation method. By analyzing the results, it is found that (i) the electric field strength in the AlN barrier layer is large because it is ultrathin, and the piezoelectric tensor coefficient of AlN material is large; thus, the inverse piezoelectric effect is very strong. A large number of additional polarization charges are generated under the gate, which can generate a strong PCF scattering potential and enhance PCF scattering. What's more, the AlN barrier layer cannot be infinitely strained by the gate bias with the converse piezoelectric effect, and the additional polarization charges will become saturated with the decrease in gate bias. (ii) The AlN barrier layer of AlN/GaN HFETs is ultrathin, the two-dimensional electron gas (2DEG) density under the gate is quickly decreased by the gate bias, and, with the decrease in 2DEG density, PCF scattering is enhanced. [ABSTRACT FROM AUTHOR]

Identically-sized AlGaN/GaN HFETs were fabricated on three AlGaN/GaN heterostructure with differing AlGaN barrier layer thicknesses of 15.5 nm, 19.3 nm and 24.7 nm. Based on polarization Coulomb field (PCF) scattering theory, additional polarization charges and electron mobility under the gate were calculated, and the relationship between AlGaN barrier layer thickness and P C F scattering in AlGaN/GaN H F E T s was determined. For the AlGaN/GaN H F E T s with a thicker AlGaN barrier layer, when the same gate bias was applied to the gate, the inverse piezoelectric effect (IPE) of the barrier layer was weaker, resulting in fewer additional polarization charges. The AlGaN/GaN H F E T s with a thicker AlGaN barrier layer also possessed a higher 2DEG sheet charge density, diminishing the P C F scattering intensity. It can be concluded that increasing the AlGaN barrier layer thickness reduces the IPE and raises the 2DEG sheet charge density, both of which decreases the PCF scattering intensity. The results of this study have guiding value toward the optimization of AlGaN/GaN HFETs materials and structures. • The relationship between AlGaN barrier layer thickness and polarization Coulomb field (PCF) scattering was determined. • Both of the reduce of additional polarization charges and the increase of the 2DEG density will weaken the PCF scattering. • PCF scattering intensity can be diminished by increasing the AlGaN barrier layer thickness. • The results of this study have guiding value toward the optimization of AlGaN/GaN HFETs materials and structures. [ABSTRACT FROM AUTHOR]

The AlGaN/GaN heterostructure field-effect transistors (HFETs) with the same size were fabricated on two AlGaN/GaN heterojunction materials with different Al composition. Based on the polarization Coulomb field (PCF) scattering theory model, the additional polarization charges and electron mobility are calculated. By analyzing the results, it is found that the increase of the Al composition in barrier layer will result in the increase of the additional polarization charges and the channel 2DEG density. Although HFETs with a higher Al composition in barrier layer have higher additional polarization charges, because of the higher density of 2DEG, the additional polarization charge has a weaker scattering effect on 2DEG, and the intensity of the PCF scattering is weaker. The contribution of additional polarization charges and 2DEG density to PCF scattering is opposite. The intensity of PCF scattering increases or decreases with the increase of Al composition, depending on which influence of the additional polarization charges and the 2DEG density is dominant.. • The influence mechanism of Al composition in AlGaN barrier layer on PCF scattering in AlGaN/GaN HFET has been clarified. • The increase of Al composition will result in the increase of the additional polarization charges and the 2DEG density. • The contribution of the additional polarization charges and 2DEG density to PCF scattering is opposite. • The PCF scattering increases or decreases with the increase of Al composition, depending on which above factors is dominant. [ABSTRACT FROM AUTHOR]

NCAPG2 (non-SMC condensin II complex subunit G2), as an important factor in cell mitosis, has been the focus in the study of different cancers. However, the role of NCAPG2 in the malignancy of glioblastoma cells remains unknown. The findings from the present study demonstrated that NCAPG2 was significantly increased in human glioblastoma tissues and was associated with poor clinical outcome. Moreover, NCAPG2 could promote proliferation, migration, and invasion and regulate cell cycle in glioblastoma cells. Investigation of the molecular mechanism indicated that NCAPG2 regulated HBO1 phosphorylation and H4 histone acetylase activation, modulated the activation of Wnt/β-catenin pathway, and the binding of MCM protein to chromatin to exert its role. Furthermore, knockdown of HBO1 was found to reverse the effect of NCAPG2 overexpression on cell proliferation, migration, invasion, and cell cycle. In addition, knockdown of NCAPG2 attenuated glioblastoma tumorigenesis in vivo. Taken together, the findings demonstrated that NCAPG2 facilitates the malignancy of glioblastoma cells and xenograft tumor growth via HBO1 activation by phosphorylation. These results improve our understanding of the mechanism underlying glioblastoma progression and may contribute to the identification of novel biomarkers and therapeutic targets for glioblastoma. [ABSTRACT FROM AUTHOR]

In this study, a split-gate AlGaN/GaN heterostructure field-effect transistor with an auxiliary gate was fabricated. Through experiment and analysis, it was discovered that by applying a constant potential (usually 0 V or negative potential) to the auxiliary gate, a negative bias can be formed between the auxiliary gate and the channel. This consumes the two-dimensional electron gas in the channel, leading to significant improvements in the saturation characteristics of split-gate devices. By applying different potentials to the main gate and the auxiliary gate, a variety of device working modes can be obtained, and the threshold voltage can be altered across a large range. These advantages make split-gate devices with auxiliary gates more suitable for increasingly complex integrated circuit applications. [ABSTRACT FROM AUTHOR]

The relationship between mobility and subthreshold swing (SS) of AlGaN/GaN HFETs was investigated at 10 and 20 V drain bias using the Monte Carlo method. We find that the polarization Coulomb field (PCF) scattering dominates the mobility at both 10 and 20 V drain bias. The channel carrier mobility is reduced as the gate bias becomes more negative, which reduces SS. The influence of mobility has not been considered in the 60 mV/dec rule, and PCF scattering is crucial for SS to be lower than 60 mV/dec in AlGaN/GaN HFETs. However, when the drain bias is 10 V, the CF scattering significantly diminishes SS. When the drain bias is 20 V, the SS barely decreases. Accordingly, a lower drain–source bias is needed to appropriately reduce SS. [ABSTRACT FROM AUTHOR]

In this study, a novel AlGaN/GaN heterostructure field-effect transistor based on open-gate technology was fabricated. Sample transistors of different structures and sizes were constructed. Through measurements, it was found that by changing the width of the opening, the threshold voltage of the device could be easily modulated across a larger range. The open-gate device had two working modes with different transconductance. When the gate-source voltage VGS ≤ − 4.5 V, only the open region was conductive, and a new working mechanism modulated the channel current. Corresponding theoretical analysis and calculations showed that its saturation mechanism was related to a virtual gate formed by electron injection onto the surface. Also, the gate-source voltage modulated the open channel current by changing the channel electron mobility through polarization Coulomb field scattering. When used as class-A voltage amplifiers, open-gate devices can achieve effective voltage amplification with very low power consumption. [ABSTRACT FROM AUTHOR]

This paper demonstrates the improvement of device linearity in AlGaN/GaN heterostructure field effect transistors (HFETs) using polarization Coulomb field (PCF) scattering and investigates the relationship between device linearity and PCF scattering under 10 and 20 V drain bias. The mobility of the gate-to-source region in AlGaN/GaN HFETs is calculated using the Monte Carlo method. We find that PCF scattering decreases with an increase in gate bias (from −3 to −0.5 V) under high field conditions, leading to lower gate-to-source resistance. Under 20 V drain bias, linearity is worse than under 10 V drain bias. The transconductance drop is significant in AlGaN/GaN HFETs, which damages linearity. By adopting an appropriate drain bias, PCF scattering can alleviate transconductance drop and improve the linearity of AlGaN/GaN HFETs. [ABSTRACT FROM AUTHOR]

In this work, two AlGaN/AlN/GaN heterostructure field-effect transistors (HFETs) with different ratios of gate length (L G) to gate-drain distance (L GD) were used to compare the effects of ratio of L G to L GD on the source access resistance (R GS) at 300 K , 350 K , and 400 K. The results showed that the ratio of L G to L GD had a significant effect on R GS at the above-mentioned each temperature, which can be attributed to the polarization Coulomb field (PCF) scattering. In addition, the effects of the ratio of L G to L GD on R GS in the two AlGaN/AlN/GaN HFETs prepared in this work were different at different temperatures. This indicated that elevated-temperature performance of AlGaN/AlN/GaN HFETs can be improved by optimizing the ratio of L G to L GD based on PCF scattering. [Display omitted] • The effects of the ratio of L G to L GD on R GS in AlGaN/AlN/GaN HFETs are investigated at different temperatures. • It is found that the ratio of L G to L GD has a significant effect on R GS at each testing temperature. • PCF scattering is responsible for the effects of the ratio of L G to L GD on R GS. • R GS can be modulated by optimizing the ratio of L G to L GD based on PCF scattering. [ABSTRACT FROM AUTHOR]