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Electromigration reliability issues in dual-damascene Cu interconnections
- Source :
- IEEE Transactions on Reliability. Dec, 2002, Vol. 51 Issue 4, p403, 17 p.
- Publication Year :
- 2002
-
Abstract
- An overview on Cu interconnects is presented.
Details
- ISSN :
- 00189529
- Volume :
- 51
- Issue :
- 4
- Database :
- Gale General OneFile
- Journal :
- IEEE Transactions on Reliability
- Publication Type :
- Academic Journal
- Accession number :
- edsgcl.97444271