Cite
Electromigration reliability issues in dual-damascene Cu interconnections
MLA
Ogawa, Ennis T., et al. “Electromigration Reliability Issues in Dual-Damascene Cu Interconnections.” IEEE Transactions on Reliability, vol. 51, no. 4, Dec. 2002, p. 403. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsggo&AN=edsgcl.97444271&authtype=sso&custid=ns315887.
APA
Ogawa, E. T., Lee, K.-D., Blaschke, V. A., & Ho, P. S. (2002). Electromigration reliability issues in dual-damascene Cu interconnections. IEEE Transactions on Reliability, 51(4), 403.
Chicago
Ogawa, Ennis T., Ki-Don Lee, Volker A. Blaschke, and Paul S. Ho. 2002. “Electromigration Reliability Issues in Dual-Damascene Cu Interconnections.” IEEE Transactions on Reliability 51 (4): 403. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsggo&AN=edsgcl.97444271&authtype=sso&custid=ns315887.