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Electromigration in Sn-Pb solder strips as a function of alloy composition
- Source :
- Journal of Applied Physics. Nov 15, 2000, Vol. 88 Issue 10, p5703, 7 p.
- Publication Year :
- 2000
-
Abstract
- Research describing electromigration in thin film solder strips of differing tin-lead composition is presented. The work has implications for microprocessor technology as electromigration may be a serious concern in solder bumps for chip to package interconnects.
Details
- ISSN :
- 00218979
- Volume :
- 88
- Issue :
- 10
- Database :
- Gale General OneFile
- Journal :
- Journal of Applied Physics
- Publication Type :
- Academic Journal
- Accession number :
- edsgcl.76955184