Electromigration in Sn-Pb solder strips as a function of alloy composition

MLA

Liu, C. Y., et al. “Electromigration in Sn-Pb Solder Strips as a Function of Alloy Composition.” Journal of Applied Physics, vol. 88, no. 10, Nov. 2000, p. 5703. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsggo&AN=edsgcl.76955184&authtype=sso&custid=ns315887.

APA

Liu, C. Y., Chen, C., & Tu, K. N. (2000). Electromigration in Sn-Pb solder strips as a function of alloy composition. Journal of Applied Physics, 88(10), 5703.

Chicago

Liu, C.Y., Chih Chen, and K.N. Tu. 2000. “Electromigration in Sn-Pb Solder Strips as a Function of Alloy Composition.” Journal of Applied Physics 88 (10): 5703. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsggo&AN=edsgcl.76955184&authtype=sso&custid=ns315887.