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Surface functionalization of micro silver flakes and their application in electrically conductive adhesives for electronic package
- Source :
- International Journal of Adhesion and Adhesives. 48:177-182
- Publication Year :
- 2014
- Publisher :
- Elsevier BV, 2014.
-
Abstract
- In this study, we used 3-aminopropyltrimethoxysilane, hexanedioic acid, 3-mercaptopropyltrimethoxysilane, and thioglycolic acid to functionalize the surface of micro silver flakes through in-situ replacements. Hexanedioic acid had the best effect on the functionalization. When the content of hexanedioic acid was 0.5–1 wt% of micro silver flakes, it could fully replace the long chain fatty acid and form a very thin molecular film on the surface of micro silver flakes. The micro silver flakes functionalized by hexanedioic acid played a significant role in the regards of improving the properties of electrically conductive adhesives, and letting the adhesives have low viscosity, e.g., 28,000 cPs, low bulk resistivity, e.g., 2.4×10 −4 Ω cm, and high shear strength, e.g, 10.4 MPa.
- Subjects :
- Materials science
Polymers and Plastics
General Chemical Engineering
food and beverages
Electrically conductive
Biomaterials
Electronic packages
chemistry.chemical_compound
chemistry
Molecular film
Shear strength
Surface modification
Thioglycolic acid
Adhesive
Long chain fatty acid
Composite material
Subjects
Details
- ISSN :
- 01437496
- Volume :
- 48
- Database :
- OpenAIRE
- Journal :
- International Journal of Adhesion and Adhesives
- Accession number :
- edsair.doi...........8effaa52ad0773ac1829a375e8745118