Cite
Surface functionalization of micro silver flakes and their application in electrically conductive adhesives for electronic package
MLA
Hui-Wang Cui, et al. “Surface Functionalization of Micro Silver Flakes and Their Application in Electrically Conductive Adhesives for Electronic Package.” International Journal of Adhesion and Adhesives, vol. 48, Jan. 2014, pp. 177–82. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi...........8effaa52ad0773ac1829a375e8745118&authtype=sso&custid=ns315887.
APA
Hui-Wang Cui, Dong-sheng Li, & Qiong Fan. (2014). Surface functionalization of micro silver flakes and their application in electrically conductive adhesives for electronic package. International Journal of Adhesion and Adhesives, 48, 177–182.
Chicago
Hui-Wang Cui, Dong-sheng Li, and Qiong Fan. 2014. “Surface Functionalization of Micro Silver Flakes and Their Application in Electrically Conductive Adhesives for Electronic Package.” International Journal of Adhesion and Adhesives 48 (January): 177–82. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi...........8effaa52ad0773ac1829a375e8745118&authtype=sso&custid=ns315887.