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Identification and Rating of Workforce Competencies for Manufacturing Process Engineers: Case Study of an IC Packaging Process Engineer

Authors :
Chung-Yi Wu
Ling-Jing Kao
Chih-Chou Chiu
Cheng-Chin Lu
Source :
IEEE Transactions on Engineering Management. 70:196-208
Publication Year :
2023
Publisher :
Institute of Electrical and Electronics Engineers (IEEE), 2023.

Abstract

According to previous studies, the workforce competencies of engineers in manufacturing industries generally comprise technical, generic, and knowledge competencies. However, these categories of workforce competencies are insufficient for firms whose manufacturing processes are very easily interrupted by anomalies and whose core competency is highly related to production yield. In addition to drawing attention to the importance of identifying engineers’ problem-solving competencies, this article proposes a procedure to identify and rate workforce competencies for firms in the manufacturing industry. An IC packaging process engineer was used as an example to illustrate the proposed competency identification and rating procedure. In contrast to previous studies, this article suggests that problem-solving competencies can be identified from engineers’ responses to the anomalies commonly encountered in each step of the manufacturing process and that operational competency can be identified from the knowledge, techniques, or capabilities required to fulfill a task in each step of the manufacturing process. For the IC packaging and testing industry, this article can help human resources not only evaluate the competency of job candidates but also design training courses according to the job tenure of engineers. Furthermore, this article results can be used to design teaching material for apprenticeship to help engineers develop competencies in a structured manner and enhance their sensitivities to production-line problems.

Details

ISSN :
15580040 and 00189391
Volume :
70
Database :
OpenAIRE
Journal :
IEEE Transactions on Engineering Management
Accession number :
edsair.doi...........8e4fe2091798da78f4673d105d971225