Identification and Rating of Workforce Competencies for Manufacturing Process Engineers: Case Study of an IC Packaging Process Engineer

MLA

Chung-Yi Wu, et al. “Identification and Rating of Workforce Competencies for Manufacturing Process Engineers: Case Study of an IC Packaging Process Engineer.” IEEE Transactions on Engineering Management, vol. 70, Jan. 2023, pp. 196–208. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi...........8e4fe2091798da78f4673d105d971225&authtype=sso&custid=ns315887.

APA

Chung-Yi Wu, Ling-Jing Kao, Chih-Chou Chiu, & Cheng-Chin Lu. (2023). Identification and Rating of Workforce Competencies for Manufacturing Process Engineers: Case Study of an IC Packaging Process Engineer. IEEE Transactions on Engineering Management, 70, 196–208.

Chicago

Chung-Yi Wu, Ling-Jing Kao, Chih-Chou Chiu, and Cheng-Chin Lu. 2023. “Identification and Rating of Workforce Competencies for Manufacturing Process Engineers: Case Study of an IC Packaging Process Engineer.” IEEE Transactions on Engineering Management 70 (January): 196–208. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi...........8e4fe2091798da78f4673d105d971225&authtype=sso&custid=ns315887.