Electrical testing of small-series multi-chip microcircuit samples combining Wire Bond and Flip-Chip technologies

The paper provides a technical solution and methodology for conducting automated electrical and functional testing of small series samples of multi-chip assemblies. The results of multi-chip assembly samples testing combining Wire Bond and Flip-Chip technologies are presented. Based on the test results, defects that occur during the packaging process are localized and the assembly stages at which these defects occur are determined.