Cite
Electrical testing of small-series multi-chip microcircuit samples combining Wire Bond and Flip-Chip technologies
MLA
Vadim Putrolaynen, et al. “Electrical Testing of Small-Series Multi-Chip Microcircuit Samples Combining Wire Bond and Flip-Chip Technologies.” Journal of Physics: Conference Series, vol. 1515, Apr. 2020, p. 022075. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi...........755d5cce5e9292fd9dce3c6b0992f117&authtype=sso&custid=ns315887.
APA
Vadim Putrolaynen, N. Yu Ershova, K. R. Marcinkevich, D. A. Kirienko, & P. V. Lunkov. (2020). Electrical testing of small-series multi-chip microcircuit samples combining Wire Bond and Flip-Chip technologies. Journal of Physics: Conference Series, 1515, 022075.
Chicago
Vadim Putrolaynen, N. Yu Ershova, K. R. Marcinkevich, D. A. Kirienko, and P. V. Lunkov. 2020. “Electrical Testing of Small-Series Multi-Chip Microcircuit Samples Combining Wire Bond and Flip-Chip Technologies.” Journal of Physics: Conference Series 1515 (April): 022075. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi...........755d5cce5e9292fd9dce3c6b0992f117&authtype=sso&custid=ns315887.