Mechanical–Thermal–Electrical Coupling Modeling and Temperature Rise Characteristic of a Parallel Groove Clamp With Improved Representation of Contact Interactions

Authors :: Wenxin He
Yu Feng
Shaolei Wu
Wei Wang
Source :: IEEE Transactions on Components, Packaging and Manufacturing Technology. 13:356-364
Publication Year :: 2023
Publisher :: Institute of Electrical and Electronics Engineers (IEEE), 2023.

Subjects :: Electrical and Electronic Engineering
Industrial and Manufacturing Engineering
Electronic, Optical and Magnetic Materials

ISSN :: 21563985 and 21563950
Volume :: 13
Database :: OpenAIRE
Journal :: IEEE Transactions on Components, Packaging and Manufacturing Technology
Accession number :: edsair.doi...........6ddbc02448cebcd69bdfb26d7d99ff9e

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