Mechanical–Thermal–Electrical Coupling Modeling and Temperature Rise Characteristic of a Parallel Groove Clamp With Improved Representation of Contact Interactions

MLA

Wenxin He, et al. “Mechanical–Thermal–Electrical Coupling Modeling and Temperature Rise Characteristic of a Parallel Groove Clamp With Improved Representation of Contact Interactions.” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 13, Mar. 2023, pp. 356–64. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi...........6ddbc02448cebcd69bdfb26d7d99ff9e&authtype=sso&custid=ns315887.

APA

Wenxin He, Yu Feng, Shaolei Wu, & Wei Wang. (2023). Mechanical–Thermal–Electrical Coupling Modeling and Temperature Rise Characteristic of a Parallel Groove Clamp With Improved Representation of Contact Interactions. IEEE Transactions on Components, Packaging and Manufacturing Technology, 13, 356–364.

Chicago

Wenxin He, Yu Feng, Shaolei Wu, and Wei Wang. 2023. “Mechanical–Thermal–Electrical Coupling Modeling and Temperature Rise Characteristic of a Parallel Groove Clamp With Improved Representation of Contact Interactions.” IEEE Transactions on Components, Packaging and Manufacturing Technology 13 (March): 356–64. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi...........6ddbc02448cebcd69bdfb26d7d99ff9e&authtype=sso&custid=ns315887.