Development of Analysis Methodology to Predict the Hysteresis of the Warpage of an Electronic Package during a Thermal History

Authors :: Toru Ikeda
Takuya Hatao
Shinya Kawahara
Akiko Ozaki
Noriyuki Miyazaki
Masaaki Koganemaru
Hiroshi Nakaido
Source :: Journal of Japan Institute of Electronics Packaging. 18:486-494
Publication Year :: 2015
Publisher :: Japan Institute of Electronics Packaging, 2015.

Subjects :: Electronic packages
Hysteresis
Materials science
Thermal
Mechanical engineering
Electrical and Electronic Engineering
Composite material
Viscoelasticity

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