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Development of Analysis Methodology to Predict the Hysteresis of the Warpage of an Electronic Package during a Thermal History
- Source :
- Journal of Japan Institute of Electronics Packaging. 18:486-494
- Publication Year :
- 2015
- Publisher :
- Japan Institute of Electronics Packaging, 2015.
Details
- ISSN :
- 1884121X and 13439677
- Volume :
- 18
- Database :
- OpenAIRE
- Journal :
- Journal of Japan Institute of Electronics Packaging
- Accession number :
- edsair.doi...........6a6da5f76e6596305a1658fff9fb1173