Cite
Development of Analysis Methodology to Predict the Hysteresis of the Warpage of an Electronic Package during a Thermal History
MLA
Toru Ikeda, et al. “Development of Analysis Methodology to Predict the Hysteresis of the Warpage of an Electronic Package during a Thermal History.” Journal of Japan Institute of Electronics Packaging, vol. 18, Jan. 2015, pp. 486–94. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi...........6a6da5f76e6596305a1658fff9fb1173&authtype=sso&custid=ns315887.
APA
Toru Ikeda, Takuya Hatao, Shinya Kawahara, Akiko Ozaki, Noriyuki Miyazaki, Masaaki Koganemaru, & Hiroshi Nakaido. (2015). Development of Analysis Methodology to Predict the Hysteresis of the Warpage of an Electronic Package during a Thermal History. Journal of Japan Institute of Electronics Packaging, 18, 486–494.
Chicago
Toru Ikeda, Takuya Hatao, Shinya Kawahara, Akiko Ozaki, Noriyuki Miyazaki, Masaaki Koganemaru, and Hiroshi Nakaido. 2015. “Development of Analysis Methodology to Predict the Hysteresis of the Warpage of an Electronic Package during a Thermal History.” Journal of Japan Institute of Electronics Packaging 18 (January): 486–94. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi...........6a6da5f76e6596305a1658fff9fb1173&authtype=sso&custid=ns315887.