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A lifetime prediction approach for LED packages in paralleled under thermal-electronic coupling effects

Authors :
Bo Sun
Yaoyang Shen
Zhihao Zhang
Chunbing Guo
Chengqiang Cui
Source :
Microelectronics Reliability. 142:114904
Publication Year :
2023
Publisher :
Elsevier BV, 2023.

Subjects

Subjects :
Electrical and Electronic Engineering
Safety, Risk, Reliability and Quality
Condensed Matter Physics
Atomic and Molecular Physics, and Optics
Surfaces, Coatings and Films
Electronic, Optical and Magnetic Materials

Details

ISSN :
00262714
Volume :
142
Database :
OpenAIRE
Journal :
Microelectronics Reliability
Accession number :
edsair.doi...........6012197a3ccd2e23fd6d34556ac38fc2
Full Text :
https://doi.org/10.1016/j.microrel.2023.114904
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