A lifetime prediction approach for LED packages in paralleled under thermal-electronic coupling effects

MLA

Bo Sun, et al. “A Lifetime Prediction Approach for LED Packages in Paralleled under Thermal-Electronic Coupling Effects.” Microelectronics Reliability, vol. 142, Mar. 2023, p. 114904. EBSCOhost, https://doi.org/10.1016/j.microrel.2023.114904.

APA

Bo Sun, Yaoyang Shen, Zhihao Zhang, Chunbing Guo, & Chengqiang Cui. (2023). A lifetime prediction approach for LED packages in paralleled under thermal-electronic coupling effects. Microelectronics Reliability, 142, 114904. https://doi.org/10.1016/j.microrel.2023.114904

Chicago

Bo Sun, Yaoyang Shen, Zhihao Zhang, Chunbing Guo, and Chengqiang Cui. 2023. “A Lifetime Prediction Approach for LED Packages in Paralleled under Thermal-Electronic Coupling Effects.” Microelectronics Reliability 142 (March): 114904. doi:10.1016/j.microrel.2023.114904.