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Enhanced Ti3AlC2/Zircaloy-4 interfacial bonding by using copper as an interlayer
- Source :
- Materials Science and Engineering: A. 871:144914
- Publication Year :
- 2023
- Publisher :
- Elsevier BV, 2023.
Details
- ISSN :
- 09215093
- Volume :
- 871
- Database :
- OpenAIRE
- Journal :
- Materials Science and Engineering: A
- Accession number :
- edsair.doi...........596395f2b2d8bf2c5aaf5011496a783a