Enhanced Ti3AlC2/Zircaloy-4 interfacial bonding by using copper as an interlayer

MLA

Bo Yang, et al. “Enhanced Ti3AlC2/Zircaloy-4 Interfacial Bonding by Using Copper as an Interlayer.” Materials Science and Engineering: A, vol. 871, Apr. 2023, p. 144914. EBSCOhost, https://doi.org/10.1016/j.msea.2023.144914.

APA

Bo Yang, Chun Li, Xiaoyang Wang, Hao Yuan, Mingshen Li, Xiaoqing Si, Junlei Qi, & Jian Cao. (2023). Enhanced Ti3AlC2/Zircaloy-4 interfacial bonding by using copper as an interlayer. Materials Science and Engineering: A, 871, 144914. https://doi.org/10.1016/j.msea.2023.144914

Chicago

Bo Yang, Chun Li, Xiaoyang Wang, Hao Yuan, Mingshen Li, Xiaoqing Si, Junlei Qi, and Jian Cao. 2023. “Enhanced Ti3AlC2/Zircaloy-4 Interfacial Bonding by Using Copper as an Interlayer.” Materials Science and Engineering: A 871 (April): 144914. doi:10.1016/j.msea.2023.144914.