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Novel Al /AlN bonding by micro-sized Ag particles sinter joining in low temperature low pressure air conditions
- Source :
- 2023 International Conference on Electronics Packaging (ICEP).
- Publication Year :
- 2023
- Publisher :
- IEEE, 2023.
Details
- Database :
- OpenAIRE
- Journal :
- 2023 International Conference on Electronics Packaging (ICEP)
- Accession number :
- edsair.doi...........547d16ad6d9dd7d19a997ad6d8321361