Novel Al /AlN bonding by micro-sized Ag particles sinter joining in low temperature low pressure air conditions

MLA

Chuantong Chen, et al. “Novel Al /AlN Bonding by Micro-Sized Ag Particles Sinter Joining in Low Temperature Low Pressure Air Conditions.” 2023 International Conference on Electronics Packaging (ICEP), Apr. 2023. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi...........547d16ad6d9dd7d19a997ad6d8321361&authtype=sso&custid=ns315887.

APA

Chuantong Chen, Yang Liu, Minoru Ueshima, & Katsuaki Suganuma. (2023). Novel Al /AlN bonding by micro-sized Ag particles sinter joining in low temperature low pressure air conditions. 2023 International Conference on Electronics Packaging (ICEP).

Chicago

Chuantong Chen, Yang Liu, Minoru Ueshima, and Katsuaki Suganuma. 2023. “Novel Al /AlN Bonding by Micro-Sized Ag Particles Sinter Joining in Low Temperature Low Pressure Air Conditions.” 2023 International Conference on Electronics Packaging (ICEP), April. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi...........547d16ad6d9dd7d19a997ad6d8321361&authtype=sso&custid=ns315887.