Laser-produced plasma light source for EUVL

This paper is devoted to the development of laser produced plasma (LPP) EUV source architecture for advanced lithography applications in high volume manufacturing of integrated circuits. The paper describes the development status of subsystems most critical to the performance to meet scanner manufacturer requirements for power and debris mitigation. Spatial and temporal distributions of the radiation delivered to the illuminator of the scanner are important parameters of the production EUV tool, this paper reports on these parameters measured at the nominal repetition rate of the EUV source. The lifetime of the collector mirror is a critical parameter in the development of extreme ultra-violet LPP lithography sources. Deposition of target material and contaminants as well as sputtering and implantation of incident particles can reduce the reflectivity of the mirror coating substantially over time during exposure even though debris mitigation schemes are being employed. We report on progress of life-test experiments of exposed 1.6sr collectors using a Sn LPP EUV light source. The erosion of MLM coating is caused mostly by the high-energy ions generated from the plasma. In this manuscript the ion distribution measured at small (14 degree) and medium (45 degree) angles to the laser beam are presented. The measurements show that the chosen combination of the CO2 laser and Sn droplet targets is characterized by fairly uniform angular ion energy distribution. The maximum ion energy generated from the plasma is in the range of 3-3.5 keV for all incident angles of the collector. The measured maximum energy of the ions is significantly less than that measured and simulated for plasmas generated by short wavelength lasers (1 μm). The separation of ions with different charge states was observed when a retarding potential was applied to the Faraday Cup detector.