Failure Mechanism of Aluminum Diffusion in Low-Voltage Trench MOSFET With High Cell Density

Authors :: Dong Fang
Ming Qiao
Tao Zhong
Kui Xiao
Zheng Bian
Zhaoji Li
Bo Zhang
Source :: IEEE Transactions on Device and Materials Reliability. 22:403-409
Publication Year :: 2022
Publisher :: Institute of Electrical and Electronics Engineers (IEEE), 2022.

Subjects :: Electrical and Electronic Engineering
Safety, Risk, Reliability and Quality
Electronic, Optical and Magnetic Materials

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