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In-Situ Low Energy Ion Milling with a FIB-SEM for TEM lift-out Sample Preparation of Copper Damascene Structures Fabricated with Low k porous SiLKTM Semiconductor Dielectric
- Source :
- Microscopy and Microanalysis. 9:874-875
- Publication Year :
- 2003
- Publisher :
- Oxford University Press (OUP), 2003.
Details
- ISSN :
- 14358115 and 14319276
- Volume :
- 9
- Database :
- OpenAIRE
- Journal :
- Microscopy and Microanalysis
- Accession number :
- edsair.doi...........2e3e98e3856bc4eb4e25d2322535a6fe
- Full Text :
- https://doi.org/10.1017/s1431927603444371