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Post-Etch Cleaning Chemistries Evaluation for Low k-Copper Integration
- Source :
- Solid State Phenomena. 92:263-266
- Publication Year :
- 2003
- Publisher :
- Trans Tech Publications, Ltd., 2003.
Details
- ISSN :
- 16629779
- Volume :
- 92
- Database :
- OpenAIRE
- Journal :
- Solid State Phenomena
- Accession number :
- edsair.doi...........141229005717e6519057c949af589684
- Full Text :
- https://doi.org/10.4028/www.scientific.net/ssp.92.263