Post-Etch Cleaning Chemistries Evaluation for Low k-Copper Integration

MLA

O. Hinsinger, et al. “Post-Etch Cleaning Chemistries Evaluation for Low k-Copper Integration.” Solid State Phenomena, vol. 92, May 2003, pp. 263–66. EBSCOhost, https://doi.org/10.4028/www.scientific.net/ssp.92.263.

APA

O. Hinsinger, Pascal Besson, S. Favier, & Lucile Broussous. (2003). Post-Etch Cleaning Chemistries Evaluation for Low k-Copper Integration. Solid State Phenomena, 92, 263–266. https://doi.org/10.4028/www.scientific.net/ssp.92.263

Chicago

O. Hinsinger, Pascal Besson, S. Favier, and Lucile Broussous. 2003. “Post-Etch Cleaning Chemistries Evaluation for Low k-Copper Integration.” Solid State Phenomena 92 (May): 263–66. doi:10.4028/www.scientific.net/ssp.92.263.