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Stress in copper films for interconnects
- Source :
- Microelectronic Engineering; 1997, Vol. 37 Issue: 1 p151-156, 6p
- Publication Year :
- 1997
Details
- Language :
- English
- ISSN :
- 01679317
- Volume :
- 37
- Issue :
- 1
- Database :
- Supplemental Index
- Journal :
- Microelectronic Engineering
- Publication Type :
- Periodical
- Accession number :
- ejs2931335
- Full Text :
- https://doi.org/10.1016/S0167-9317(97)00106-8