Cite
Stress in copper films for interconnects
MLA
Riedel, S., et al. “Stress in Copper Films for Interconnects.” Microelectronic Engineering, vol. 37, no. 1, Jan. 1997, pp. 151–56. EBSCOhost, https://doi.org/10.1016/S0167-9317(97)00106-8.
APA
Riedel, S., Roeber, J., Schulz, S. E., & Gessner, T. (1997). Stress in copper films for interconnects. Microelectronic Engineering, 37(1), 151–156. https://doi.org/10.1016/S0167-9317(97)00106-8
Chicago
Riedel, S., J. Roeber, S. E. Schulz, and T. Gessner. 1997. “Stress in Copper Films for Interconnects.” Microelectronic Engineering 37 (1): 151–56. doi:10.1016/S0167-9317(97)00106-8.