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Electrical Line Monitoring in a 300 mm Copper Fab.
- Source :
- Semiconductor International; Jul2003, Vol. 26 Issue 8, p80, 6p
- Publication Year :
- 2003
-
Abstract
- Focuses on the development of eS20XP, an electrical line monitoring methodology to identify buried defects in 300 mm copper devices, by Texas Instruments Inc.'s DMOS6 and KLA-Tencor Corp. Features of the approach; Description for e-beam inspection line monitoring strategy; Optimization of overall wafer inspection strategy using the approach.
Details
- Language :
- English
- ISSN :
- 01633767
- Volume :
- 26
- Issue :
- 8
- Database :
- Supplemental Index
- Journal :
- Semiconductor International
- Publication Type :
- Periodical
- Accession number :
- 10209398