Electrical packaging impact on source components in optical interconnects.

Authors :: Neifeld, M.A.
Wu-Chun Chou
Source :: Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging; 1994, p235-238, 4p
Publication Year :: 1994

Language :: English
ISBNs :: 9780780324114
Database :: Complementary Index
Journal :: Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging
Publication Type :: Conference
Accession number :: 92266657
Full Text :: https://doi.org/10.1109/EPEP.1994.594157