Cite

Electrical packaging impact on source components in optical interconnects.

MLA

Neifeld, M. A., and Wu-Chun Chou. “Electrical Packaging Impact on Source Components in Optical Interconnects.” Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging, Jan. 1994, pp. 235–38. EBSCOhost, https://doi.org/10.1109/EPEP.1994.594157.



APA

Neifeld, M. A., & Wu-Chun Chou. (1994). Electrical packaging impact on source components in optical interconnects. Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging, 235–238. https://doi.org/10.1109/EPEP.1994.594157



Chicago

Neifeld, M.A., and Wu-Chun Chou. 1994. “Electrical Packaging Impact on Source Components in Optical Interconnects.” Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging, January, 235–38. doi:10.1109/EPEP.1994.594157.