Failure mechanism of hole formation in laser welding technique for optoelectronic packaging.

Details

Language :

English

ISBNs :

9780780327368

Database :

Complementary Index

Journal :

1995 Proceedings 45th Electronic Components & Technology Conference

Publication Type :

Conference

Accession number :

92107782

Full Text :

https://doi.org/10.1109/ECTC.1995.517798