Failure mechanism of hole formation in laser welding technique for optoelectronic packaging.

MLA

Cheng, W. H., et al. “Failure Mechanism of Hole Formation in Laser Welding Technique for Optoelectronic Packaging.” 1995 Proceedings 45th Electronic Components & Technology Conference, Jan. 1995, pp. 914–16. EBSCOhost, https://doi.org/10.1109/ECTC.1995.517798.

APA

Cheng, W. H., Wang, W. H., Huang, Y. M., Chen, H. Y., & Lin, H. H. (1995). Failure mechanism of hole formation in laser welding technique for optoelectronic packaging. 1995 Proceedings 45th Electronic Components & Technology Conference, 914–916. https://doi.org/10.1109/ECTC.1995.517798

Chicago

Cheng, W.H., W.H. Wang, Y.M. Huang, H.Y. Chen, and H.H. Lin. 1995. “Failure Mechanism of Hole Formation in Laser Welding Technique for Optoelectronic Packaging.” 1995 Proceedings 45th Electronic Components & Technology Conference, January, 914–16. doi:10.1109/ECTC.1995.517798.