3D chip stacking & reliability using TSV-micro C4 solder interconnection.

Authors :: Au, K. Y.
Kriangsak, S. L.
Zhang, X. R.
Zhu, W. H.
Toh, C. H.
Source :: 2010 Proceedings 60th Electronic Components & Technology Conference (ECTC); 2010, p1376-1384, 9p
Publication Year :: 2010

Language :: English
ISBNs :: 9781424464104
Database :: Complementary Index
Journal :: 2010 Proceedings 60th Electronic Components & Technology Conference (ECTC)
Publication Type :: Conference
Accession number :: 81602594
Full Text :: https://doi.org/10.1109/ECTC.2010.5490636