3D chip stacking & reliability using TSV-micro C4 solder interconnection.

MLA

Au, K. Y., et al. “3D Chip Stacking & Reliability Using TSV-Micro C4 Solder Interconnection.” 2010 Proceedings 60th Electronic Components & Technology Conference (ECTC), Jan. 2010, pp. 1376–84. EBSCOhost, https://doi.org/10.1109/ECTC.2010.5490636.

APA

Au, K. Y., Kriangsak, S. L., Zhang, X. R., Zhu, W. H., & Toh, C. H. (2010). 3D chip stacking & reliability using TSV-micro C4 solder interconnection. 2010 Proceedings 60th Electronic Components & Technology Conference (ECTC), 1376–1384. https://doi.org/10.1109/ECTC.2010.5490636

Chicago

Au, K. Y., S. L. Kriangsak, X. R. Zhang, W. H. Zhu, and C. H. Toh. 2010. “3D Chip Stacking & Reliability Using TSV-Micro C4 Solder Interconnection.” 2010 Proceedings 60th Electronic Components & Technology Conference (ECTC), January, 1376–84. doi:10.1109/ECTC.2010.5490636.