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Application of 3D modeling tools for advanced packaging on a broad range of industrial applications.

Authors :
Imbs, Y.
Marechal, L.
Auchere, D.
Graziosi, G.
Debono, J.
Source :
2009 European Microelectronics & Packaging Conference; 2009, p1-8, 8p
Publication Year :
2009

Details

Language :
English
ISBNs :
9781424447220
Database :
Complementary Index
Journal :
2009 European Microelectronics & Packaging Conference
Publication Type :
Conference
Accession number :
81440669

Tools

Authors Abstract Subjects Details