Cite
Application of 3D modeling tools for advanced packaging on a broad range of industrial applications.
MLA
Imbs, Y., et al. “Application of 3D Modeling Tools for Advanced Packaging on a Broad Range of Industrial Applications.” 2009 European Microelectronics & Packaging Conference, Jan. 2009, pp. 1–8. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edb&AN=81440669&authtype=sso&custid=ns315887.
APA
Imbs, Y., Marechal, L., Auchere, D., Graziosi, G., & Debono, J. (2009). Application of 3D modeling tools for advanced packaging on a broad range of industrial applications. 2009 European Microelectronics & Packaging Conference, 1–8.
Chicago
Imbs, Y., L. Marechal, D. Auchere, G. Graziosi, and J. Debono. 2009. “Application of 3D Modeling Tools for Advanced Packaging on a Broad Range of Industrial Applications.” 2009 European Microelectronics & Packaging Conference, January, 1–8. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edb&AN=81440669&authtype=sso&custid=ns315887.