Integration and Interconnect Reliability of Warm A1 Process with CVD-A1 seed layer deposited using a novel precursor of TMAAB (trimethylarninealane borane).

Details

Language :

English

ISBNs :

9781424410699

Database :

Complementary Index

Journal :

2007 IEEE International Interconnect Technology Conference

Publication Type :

Conference

Accession number :

80910935

Full Text :

https://doi.org/10.1109/IITC.2007.382336