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Process management system analysis and design of SMT reflow soldering process.
- Source :
- 2005 6th International Conference on Electronic Packaging Technology; 2005, p279-284, 6p
- Publication Year :
- 2005
Details
- Language :
- English
- ISBNs :
- 9780780394490
- Database :
- Complementary Index
- Journal :
- 2005 6th International Conference on Electronic Packaging Technology
- Publication Type :
- Conference
- Accession number :
- 80785297
- Full Text :
- https://doi.org/10.1109/ICEPT.2005.1564743