Cite
Process management system analysis and design of SMT reflow soldering process.
MLA
Li Chun-quan, and Wu Zhao-hua. “Process Management System Analysis and Design of SMT Reflow Soldering Process.” 2005 6th International Conference on Electronic Packaging Technology, Jan. 2005, pp. 279–84. EBSCOhost, https://doi.org/10.1109/ICEPT.2005.1564743.
APA
Li Chun-quan, & Wu Zhao-hua. (2005). Process management system analysis and design of SMT reflow soldering process. 2005 6th International Conference on Electronic Packaging Technology, 279–284. https://doi.org/10.1109/ICEPT.2005.1564743
Chicago
Li Chun-quan, and Wu Zhao-hua. 2005. “Process Management System Analysis and Design of SMT Reflow Soldering Process.” 2005 6th International Conference on Electronic Packaging Technology, January, 279–84. doi:10.1109/ICEPT.2005.1564743.