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Line Edge Roughness (LER) correlation and dielectric reliability with Spacer-Defined Double Patterning (SDDP) at 20nm half pitch.
- Source :
- Interconnect Technology Conference & 2011 Materials for Advanced Metallization (IITC/MAM), 2011 IEEE International; 2011, p1-3, 3p
- Publication Year :
- 2011
Details
- Language :
- English
- ISBNs :
- 9781457705038
- Database :
- Complementary Index
- Journal :
- Interconnect Technology Conference & 2011 Materials for Advanced Metallization (IITC/MAM), 2011 IEEE International
- Publication Type :
- Conference
- Accession number :
- 80323909
- Full Text :
- https://doi.org/10.1109/IITC.2011.5940296