Comparison of Printed Circuit Board Property Variations in Response to Simulated Lead-Free Soldering.

Details

Language :

English

ISSN :

1521334X

Volume :

33

Issue :

2

Database :

Complementary Index

Journal :

IEEE Transactions on Electronics Packaging Manufacturing

Publication Type :

Academic Journal

Accession number :

50252891

Full Text :

https://doi.org/10.1109/TEPM.2010.2042453