Comparison of Printed Circuit Board Property Variations in Response to Simulated Lead-Free Soldering.

MLA

Sood, Bhanu, et al. “Comparison of Printed Circuit Board Property Variations in Response to Simulated Lead-Free Soldering.” IEEE Transactions on Electronics Packaging Manufacturing, vol. 33, no. 2, Apr. 2010, pp. 98–111. EBSCOhost, https://doi.org/10.1109/TEPM.2010.2042453.

APA

Sood, B., Sanapala, R., Das, D., Pecht, M., Huang, C. Y., & Tsai, M. Y. (2010). Comparison of Printed Circuit Board Property Variations in Response to Simulated Lead-Free Soldering. IEEE Transactions on Electronics Packaging Manufacturing, 33(2), 98–111. https://doi.org/10.1109/TEPM.2010.2042453

Chicago

Sood, Bhanu, Ravikumar Sanapala, Diganta Das, Michael Pecht, C. Y. Huang, and M. Y. Tsai. 2010. “Comparison of Printed Circuit Board Property Variations in Response to Simulated Lead-Free Soldering.” IEEE Transactions on Electronics Packaging Manufacturing 33 (2): 98–111. doi:10.1109/TEPM.2010.2042453.