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Tin Whisker Test Development--Temperature and Humidity Effects Part I: Experimental Design, Observations, and Data Collection.

Authors :
Reynolds, Heidi L.
Osenbach, John W.
Henshall, Gregory
Parker, Richard D.
Peng Su
Source :
IEEE Transactions on Electronics Packaging Manufacturing; Jan2010, Vol. 33 Issue 1, p1-15, 15p
Publication Year :
2010

Details

Language :
English
ISSN :
1521334X
Volume :
33
Issue :
1
Database :
Complementary Index
Journal :
IEEE Transactions on Electronics Packaging Manufacturing
Publication Type :
Academic Journal
Accession number :
50252879
Full Text :
https://doi.org/10.1109/TEPM.2009.2030179