Tin Whisker Test Development--Temperature and Humidity Effects Part I: Experimental Design, Observations, and Data Collection.

MLA

Reynolds, Heidi L., et al. “Tin Whisker Test Development--Temperature and Humidity Effects Part I: Experimental Design, Observations, and Data Collection.” IEEE Transactions on Electronics Packaging Manufacturing, vol. 33, no. 1, Jan. 2010, pp. 1–15. EBSCOhost, https://doi.org/10.1109/TEPM.2009.2030179.

APA

Reynolds, H. L., Osenbach, J. W., Henshall, G., Parker, R. D., & Peng Su. (2010). Tin Whisker Test Development--Temperature and Humidity Effects Part I: Experimental Design, Observations, and Data Collection. IEEE Transactions on Electronics Packaging Manufacturing, 33(1), 1–15. https://doi.org/10.1109/TEPM.2009.2030179

Chicago

Reynolds, Heidi L., John W. Osenbach, Gregory Henshall, Richard D. Parker, and Peng Su. 2010. “Tin Whisker Test Development--Temperature and Humidity Effects Part I: Experimental Design, Observations, and Data Collection.” IEEE Transactions on Electronics Packaging Manufacturing 33 (1): 1–15. doi:10.1109/TEPM.2009.2030179.