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Special Issue on Compact Interconnect Models for Gigascale Integration.
- Source :
- IEEE Transactions on Electron Devices; Sep2009, Vol. 56 Issue 9, p1784-1786, 3p
- Publication Year :
- 2009
-
Abstract
- The article discusses various reports published within the issue, including one by Koo on giga-scale on-chip global interconnect technologies, another by Kurokawa on interconnect modeling, and another by Zhao on on-chip interconnect.
- Subjects :
- INTEGRATED circuit interconnections
SEMICONDUCTORS
Subjects
Details
- Language :
- English
- ISSN :
- 00189383
- Volume :
- 56
- Issue :
- 9
- Database :
- Complementary Index
- Journal :
- IEEE Transactions on Electron Devices
- Publication Type :
- Academic Journal
- Accession number :
- 44521506
- Full Text :
- https://doi.org/10.1109/TED.2009.2026838