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Special Issue on Compact Interconnect Models for Gigascale Integration.

Authors :
SAHA, SAMAR K.
DEEN, M. JAMAL
MASUDA, HIROO
Source :
IEEE Transactions on Electron Devices; Sep2009, Vol. 56 Issue 9, p1784-1786, 3p
Publication Year :
2009

Abstract

The article discusses various reports published within the issue, including one by Koo on giga-scale on-chip global interconnect technologies, another by Kurokawa on interconnect modeling, and another by Zhao on on-chip interconnect.

Details

Language :
English
ISSN :
00189383
Volume :
56
Issue :
9
Database :
Complementary Index
Journal :
IEEE Transactions on Electron Devices
Publication Type :
Academic Journal
Accession number :
44521506
Full Text :
https://doi.org/10.1109/TED.2009.2026838