Special Issue on Compact Interconnect Models for Gigascale Integration.

MLA

Saha, Samar K., et al. “Special Issue on Compact Interconnect Models for Gigascale Integration.” IEEE Transactions on Electron Devices, vol. 56, no. 9, Sept. 2009, pp. 1784–86. EBSCOhost, https://doi.org/10.1109/TED.2009.2026838.

APA

Saha, S. K., Deen, M. J., & Masuda, H. (2009). Special Issue on Compact Interconnect Models for Gigascale Integration. IEEE Transactions on Electron Devices, 56(9), 1784–1786. https://doi.org/10.1109/TED.2009.2026838

Chicago

Saha, Samar K., M. Jamal Deen, and Hiroo Masuda. 2009. “Special Issue on Compact Interconnect Models for Gigascale Integration.” IEEE Transactions on Electron Devices 56 (9): 1784–86. doi:10.1109/TED.2009.2026838.