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Microstructure-driven electrical conductivity optimization in additively manufactured microscale copper interconnects.

Authors :
Menétrey, Maxence
van Nisselroy, Cathelijn
Mengjia Xu
Hengsteler, Julian
Spolenak, Ralph
Zambelli, Tomaso
Source :
RSC Advances; 2023, Vol. 13 Issue 20, p13575-13585, 11p
Publication Year :
2023

Details

Language :
English
ISSN :
20462069
Volume :
13
Issue :
20
Database :
Complementary Index
Journal :
RSC Advances
Publication Type :
Academic Journal
Accession number :
173497513
Full Text :
https://doi.org/10.1039/d3ra00611e