Microstructure-driven electrical conductivity optimization in additively manufactured microscale copper interconnects.

MLA

Menétrey, Maxence, et al. “Microstructure-Driven Electrical Conductivity Optimization in Additively Manufactured Microscale Copper Interconnects.” RSC Advances, vol. 13, no. 20, Mar. 2023, pp. 13575–85. EBSCOhost, https://doi.org/10.1039/d3ra00611e.

APA

Menétrey, M., van Nisselroy, C., Mengjia Xu, Hengsteler, J., Spolenak, R., & Zambelli, T. (2023). Microstructure-driven electrical conductivity optimization in additively manufactured microscale copper interconnects. RSC Advances, 13(20), 13575–13585. https://doi.org/10.1039/d3ra00611e

Chicago

Menétrey, Maxence, Cathelijn van Nisselroy, Mengjia Xu, Julian Hengsteler, Ralph Spolenak, and Tomaso Zambelli. 2023. “Microstructure-Driven Electrical Conductivity Optimization in Additively Manufactured Microscale Copper Interconnects.” RSC Advances 13 (20): 13575–85. doi:10.1039/d3ra00611e.