Determination of bond wire failure probabilities in microelectronic packages.

Authors :: Casper, Thorben
Romer, Ulrich
Schops, Sebastian
Source :: 2016 22nd International Workshop on Thermal Investigations of ICs & Systems (THERMINIC); 2016, p39-44, 6p
Publication Year :: 2016

Language :: English
ISBNs :: 9781509054503
Database :: Complementary Index
Journal :: 2016 22nd International Workshop on Thermal Investigations of ICs & Systems (THERMINIC)
Publication Type :: Conference
Accession number :: 120186726
Full Text :: https://doi.org/10.1109/THERMINIC.2016.7748645